Antec Formula 6 Nano Diamond Thermal Compound

Antec Formula 6 Nano Diamond Thermal Compound

Antec Formula 6 Nano Diamond Thermal Compound

B&H # ANFORMULA6 MFR # FORMULA 6
Antec Formula 6 Nano Diamond Thermal Compound

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  • 1Description

The Formula 6 Nano Diamond Thermal Compound from Antec protects your CPU even when it is running at full capacity. Since a small surface of the CPU is in contact with the heat sink, you need a solution that facilitates the transfer of heat, and prevents heat from escaping. The Formula 6 is a diamond-caliber solution that keeps your system and CPU cool and functioning comfortably.

Composed to perform optimally between extreme temperatures of -22 to 482°F, Formula 6's diamond particles facilitate the transfer of heat between your CPU and heat sink, thus increasing your system's efficiency.
Formula 6 is light and easy enough to apply without cracking or drying out.
UPC: 761345770606
Table of Contents
  • 1Description
Diamond Particles Measuring 0.0000015 cm rated at 5.3 w/mK
Temperature Extended -22 to 482°F (-30 to 250°C) stable temperature range suitable for performance cooling
Specific Gravity 2.2 g/cm3
Compliance RoHS
Quantity 0.1 oz (4.0 g)
Packaging Info
Package Weight 0.05 lb
Box Dimensions (LxWxH) 6.7 x 2.7 x 0.8"

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