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The Formula 6 Nano Diamond Thermal Compound from Antec protects your CPU even when it is running at full capacity. Since a small surface of the CPU is in contact with the heat sink, you need a solution that facilitates the transfer of heat, and prevents heat from escaping. The Formula 6 is a diamond-caliber solution that keeps your system and CPU cool and functioning comfortably.
Composed to perform optimally between extreme temperatures of -22 to 482°F, Formula 6's diamond particles facilitate the transfer of heat between your CPU and heat sink, thus increasing your system's efficiency.
Formula 6 is light and easy enough to apply without cracking or drying out.
Table of Contents
Measuring 0.0000015 cm rated at 5.3 w/mK
Extended -22 to 482°F (-30 to 250°C) stable temperature range suitable for performance cooling