Cooler Master Thermal Fusion 400 Thermal Compound (Gray)

Cooler Master Thermal Fusion 400 Thermal Compound (Gray)

Cooler Master Thermal Fusion 400 Thermal Compound (Gray)

B&H # COTF4TGU1GP MFR # RG-TF4-TGU1-GP
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Cooler Master Thermal Fusion 400 Thermal Compound (Gray)

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Expected availability: 7-10 business days

Product Highlights

  • High Thermal Conductivity
  • Low Thermal Resistance
  • Non-Curing
  • Non-Corrosive
  • Non-Electrical Conductive
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  • 1Description

The gray Thermal Fusion 400 Thermal Compound from Cooler Master is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits help avoid short circuits. It provides the optimal solution for thermal dissipation to improve CPU/GPU cooling, as well as other bonding applications.

High Thermal Conductivity
Low Thermal Resistance
Non-Curing
Non-Corrosive
Non-Electrical Conductive
UPC: 884102002687
Table of Contents
  • 1Description
Specific Gravity 3.5 (at 25°C)
Thermal Conductivity 2.89 (W/m-K)
Volume Resistivity 2.0E+10 ohm-cm
Thermal Resistance 0.032 °C-cm2/W
Bond Line Thickness 0.008 mm
Volatile Content <0.1%
Net Weight 0.1 oz (4.0 g)
Packaging Info
Package Weight 0.05 lb
Box Dimensions (LxWxH) 7.5 x 4.0 x 1.0"

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