Teradek Bond II Modem Plate

Teradek Bond II Modem Plate

Teradek Bond II Modem Plate

B&H # TE110032 MFR # 11-0032
Teradek Bond II Modem Plate

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Expected availability: 7-14 business days
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  • 1Description

The Bond II Modem Plate from Teradek is used to securely attach the USB modems to the Bond II wireless bonding system.

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Teradek Bond II Modem Plate
  • Limited 1-Year Warranty
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    • 1Description
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