Teradek Bond II Modem Plate

Teradek Bond II Modem Plate

Teradek Bond II Modem Plate

B&H # TE110032 MFR # 11-0032
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Expected availability: 7-14 business days
$0.00 Tax Collected Outside NY and NJ

You Pay: $50.00

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Teradek 11-0032 overview

  • 1Description

The Bond II Modem Plate from Teradek is used to securely attach the USB modems to the Bond II wireless bonding system.

In the Box
Teradek Bond II Modem Plate
  • Limited 1-Year Warranty
  • Table of Contents
    • 1Description

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