HP Intel Xeon E5-2630V3 2.40GHz Processor for Z840 Workstation

HP Intel Xeon E5-2630V3 2.40GHz Processor for Z840 Workstation

HP Intel Xeon E5-2630V3 2.40GHz Processor for Z840 Workstation

B&H # HEJ9Q17AT MFR # J9Q17AT
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HP E5-2630 V3 overview

  • 1Description

The Intel Xeon E5-2630V3 Processor from HP supports Intel Turbo Boost 2.0 technology. With this, the processor can achieve maximum speed of up to 3.2 GHz. The E5-2630V3 features 8 cores with 16 threads in a FCLGA2011-3 socket. 8 cores allow the processor to run multiple programs at the same time without slowing down the system. In addition, this Xeon processor supports DDR4 memory for improving the performance of memory-intensive workloads.

ECC memory Support
ECC Memory Support indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption.
Intel vPro Technology
Intel vPro technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security; threat management, including protection from rootkits, viruses, and malware, identity and web site access point protection, confidential personal and business data protection, and remote and local monitoring, remediation, and repair of PCs and workstations.
Intel Hyper-Threading Technology
Intel Hyper-Threading Technology (Intel HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Intel Virtualization Technology (VT-x)
Intel Virtualization technology allows one hardware platform to function as multiple virtual platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel Virtualization Technology for Directed I/O (VT-d)
Intel Virtualization technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium processor (VT-i) virtualization, adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel VT-x with Extended Page Tables (EPT)
Intel VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Intel 64 Architecture
Intel 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software. Intel 64 architecture improves performance by allowing systems to address more than 4GB of both virtual and physical memory.
Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep Technology
Enhanced Intel SpeedStep Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Intel Demand Based Switching
Intel Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel AES New Instructions
Intel AES New Instructions (Intel AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Secure Key
Intel Secure Key consists of a digital random number generator that creates truly random numbers to strengthen encryption algorithms.
OS Guard
OS Guard improves security by strengthening malware protection, and provides hardware-based protection for your server operating system.
Trusted Execution Technology
Intel Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
Execute Disable Bit
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
In the Box
HP Intel Xeon E5-2630V3 2.40GHz Processor for Z840 Workstation
  • Limited 3-Year Warranty
  • Table of Contents
    • 1Description

    HP E5-2630 V3 specs

    L3 Cache 20 MB
    Intel QPI Speed 8 GT/s
    Number of QPI Links 2
    Instruction Set 64-bit
    Instruction Set Extensions AVX 2.0
    Lithography 22 nm
    Scalability 2S
    Cores 8
    Threads 16
    Base Frequency 2.4 GHz
    Maximum Turbo Frequency 3.2 GHz
    Thermal Design Power 85 W
    Max Memory Size 768 GB (dependent on memory type)
    Memory Types DDR4 1600/1866
    Max # of Memory Channels 4
    Max Memory Bandwidth 59 GB/s
    Physical Address Extensions 46-bit
    PCI Express Revision 3.0
    PCI Express Configurations x4, x8, x16
    Max # of PCI Express Lanes 40
    Max CPU Configuration 2
    Sockets Supported FCLGA2011-3
    Case Temperature 161.8°F (72.1°C)
    Packaging Info
    Package Weight 2.45 lb
    Box Dimensions (LxWxH) 9.4 x 9.3 x 6.7"

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