Qualified for TAC 2.0, a mass ventilation hole side panel design strengthens thermal efficiency and cools down the entire system.
Key Features
- Best performed SECC Japanese steel metal
- Folded edge - for safety installation
- Stamped motherboard support - no M/B standoffs installation required, for faster M/B installation
- Configured 8 drive bays - (3 x 5.25", 5 x 3.5") drive bays for expandability of future upgrade
- Meet CE, FCC Class B requirement
TAC 2.0 thermal solution
Qualified for TAC 2.0, a mass ventilation hole side panel design strengthens thermal efficiency and cools down the entire system.
Side panel clip
The patented tool free installation side panel clip.
Stamped motherboard support
No M/B standoffs installation required, for faster M/B installation.
