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Teradek Bond 759 HEVC Backpack with V-Mount Battery Plate (Japan)

BH #TE100759JPV • MFR #10-0759-JPV
Teradek
Teradek Bond 759 HEVC Backpack with V-Mount Battery Plate (Japan)
Special Order
Expected availability: 2-4 weeks
$5,990.00
$500/mo. suggested payments for 12 Mos.
with the credit card.§ 
or Save the Tax with the credit card. 

Important Notice

  • This item is noncancelable and nonreturnable.
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Battery Plate Type
AB-Mount
V-Mount

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Teradek Bond 759 Overview

  • 1Description
  • 2Outstanding Cellular Connection
  • 3Data Band Support
  • 4Interfaces
  • 5Durable and Weather-Resistant
  • 6Teradek Compatibility

The Bond 759 HEVC Backpack from Teradek includes the Bond 757 Expansion Module with Cube 755 Encoder, a Node Cellular 4G LTE USB Modem (Japan), and a V-mount battery plate.

Outstanding Cellular Connection
Node allows you to go live from almost location, even those with the poor cellular connectivity
Data Band Support
Node can operate on every 3G/4G/LTE data band in the region
Interfaces
4-pin connector with a USB adapter provide a secure connection to your Teradek device
Durable and Weather-Resistant
Node features a rugged aluminum chassis and both 1/4"-20 and 4-40 mounting options
Teradek Compatibility
  • VidiU Go/VidiU Pro
  • Cube series
  • Link/Link Pro wireless access point
  • Bond II/Pro/Expansion Module
UPC: 818264020661

Teradek Bond 759 Specs

NetworkLTE: LTE FDD Cat 4, Bands 1, 3, 5, 8, 19
UMTS: HSDPA Cat 24, HSUPA Cat 6, Bands 850/900/2100
RF: 2 x 2 MIMO SMA
Band 17 (700 MHz), Band 13 (750 MHz), Band 5 (850 MHz), Band 4 (1700 MHz), and Band 2 (1900 MHz)
Power Class: Class 3, 23 dBm LTE Mode
Class 3, 24 dBm for UMTS/HSDPA/HSUPA Mode
Data Rate: LTE Cat 4: Up to 150 Mb/s DL, 50 Mb/s UL
HSDPA Cat 14, Up to 21 Mb/s DL
HSUPA Cat 6, Up to 5.6 Mb/s UL
SIM: Full Size
Power Input2-Pin Connector, 5 to 28 V
Power Consumption5 W Maximum
Interface4-Pin LEMO-Type
Status Display2 x LEDs
TemperatureOperating: 14 to 122°F / -10 to 50°C
Storage: -40 to 194°F / -40 to 90°C
HumidityOperating: 5 to 95% (Non-Condensing)
Storage: Maximum 90%
ConstructionMilled Aluminum (Chassis), Regulation-Compliant PCB
Mounting1/4"-20 Threaded Hole
2 x 4-40 Threaded Holes
Dimensions3.3 x 0.7 x 2.2" / 82.8 x 18.5 x 59.3 mm
Weight4 oz / 110 g

Teradek Bond 759 Reviews

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