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Teradek Bond 759 HEVC Backpack with AB-Mount Battery Plate (Japan)

BH #TE100759JPG • MFR #10-0759-JPG
Teradek Bond 759 HEVC Backpack with AB-Mount Battery Plate (Japan)
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Teradek Bond 759 Overview

  • 1Description
  • 2Outstanding Cellular Connection
  • 3Data Band Support
  • 4Interfaces
  • 5Durable and Weather-Resistant
  • 6Teradek Compatibility

The Bond 759 HEVC Backpack from Teradek includes the Bond 757 Expansion Module with Cube 755 Encoder, a Node Cellular 4G LTE USB Modem (Japan), and an AB-mount battery plate.

Outstanding Cellular Connection
Node allows you to go live from almost location, even those with the poor cellular connectivity
Data Band Support
Node can operate on every 3G/4G/LTE data band in the region
Interfaces
4-pin connector with a USB adapter provide a secure connection to your Teradek device
Durable and Weather-Resistant
Node features a rugged aluminum chassis and both 1/4"-20 and 4-40 mounting options
Teradek Compatibility
  • VidiU Go/VidiU Pro
  • Cube series
  • Link/Link Pro wireless access point
  • Bond II/Pro/Expansion Module

Teradek Bond 759 Specs

Network
LTE: LTE FDD Cat 4, Bands 1, 3, 5, 8, 19
UMTS: HSDPA Cat 24, HSUPA Cat 6, Bands 850/900/2100
RF: 2 x 2 MIMO SMA
Band 17 (700 MHz), Band 13 (750 MHz), Band 5 (850 MHz), Band 4 (1700 MHz), and Band 2 (1900 MHz)
Power Class: Class 3, 23 dBm LTE Mode
Class 3, 24 dBm for UMTS/HSDPA/HSUPA Mode
Data Rate: LTE Cat 4: Up to 150 Mb/s DL, 50 Mb/s UL
HSDPA Cat 14, Up to 21 Mb/s DL
HSUPA Cat 6, Up to 5.6 Mb/s UL
SIM: Full Size
Power Input
2-Pin Connector, 5 to 28 V
Power Consumption
5 W Maximum
Interface
4-Pin LEMO-Type
Status Display
2 x LEDs
Temperature
Operating: 14 to 122°F / -10 to 50°C
Storage: -40 to 194°F / -40 to 90°C
Humidity
Operating: 5 to 95% (Non-Condensing)
Storage: Maximum 90%
Construction
Milled Aluminum (Chassis), Regulation-Compliant PCB
Mounting
1/4"-20 Threaded Hole
2 x 4-40 Threaded Holes
Dimensions
3.3 x 0.7 x 2.2" / 82.8 x 18.5 x 59.3 mm
Weight
4 oz / 110 g

Teradek Bond 759 Reviews

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