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Teradek Bond 659 AVC Backpack with V-Mount Battery Plate (Japan)

BH #TE100659JPV • MFR #10-0659-JPV
Teradek Bond 659 AVC Backpack with V-Mount Battery Plate (Japan)
Discontinued
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Teradek Bond 659 Overview

The Bond 659 AVC Backpack from Teradek includes the Bond 657 Expansion Module with Cube 655 Encoder, a Node Cellular 4G LTE USB Modem (Japan), and a V-mount battery plate.

Teradek Bond 318 and Cube 655 Package

The Bond 318 and Cube 655 Package from Teradek includes a Bond 318 Expansion Module and a Cube 655 Encoder. The bond module supports up to five USB devices, Ethernet, and Wi-Fi. It also supports up to four iOS devices and is compatible with Cube 605/655, 715/755, and 805/855.

The Cube 655 encoder comes with one SD/HD-SDI (75 Ohm BNC) and one HDMI type A receptacle inputs. It can be mounted horizontally or vertically with 1/4"-20 mounting holes.

Real-time H.264 encoder with network bonding
Network bond six USB modems (1 Cube + 5 Bond)
Dual-band 2.4/5.8 GHz Wi-Fi, Ethernet
HDMI and SDI video inputs
Bond module has built-in Li-ion battery for swapping
Built-in color grading
UPC: 818264020852
Teradek Node Cellular 3G/4G/LTE USB Modem (Japan)

The Node Cellular 4G LTE USB Modem from Teradek enables you to broadcast over 3G, 4G, and 4G LTE network interfaces. A rugged, weather-resistant aluminum chassis and a 4-pin LEMO-type connector provide reliable operation, even under challenging conditions. The Node 3G/4G/LTE offers universal SIM compatibility and uses high-gain external antennas to obtain outstanding cellular connectivity in almost any location. The 4-pin LEMO-type output can be adapted to USB, using the included 13" cable.

Outstanding Cellular Connection
Node allows you to go live from almost location, even those with the poor cellular connectivity
Data Band Support
Node can operate on every 3G/4G/LTE data band in the region
Interfaces
4-pin connector with a USB adapter provide a secure connection to your Teradek device
Durable and Weather-Resistant
Node features a rugged aluminum chassis and both 1/4"-20 and 4-40 mounting options
Teradek Compatibility
  • VidiU Go/VidiU Pro
  • Cube series
  • Link/Link Pro wireless access point
  • Bond II/Pro/Expansion Module
UPC: 818264020661

Teradek Bond 318 and Cube 655 Package Specs

Module
USBUp to five USB devices
ConnectivityEthernet and Wi-Fi (built into Cube)
Up to four iOS devices
CompatibilityCube 605/655, 715/755, 805/855
InterfacesControlled through Cube
4x powered USB 2.0 host port
BatteryInternal lithium-ion
Power ConsumptionNominal: 0.5 W, up to 5 W per USB device
Power supplied by Cube
TemperatureOperating: 14 to 122°F (-10 to 50°C)
Storage: -40 to 194°F (-40 to 90°C)
HumidityOperating: 5% to 95% (non-condensing)
Storage: Maximum 90%
ConstructionMilled aluminum (Chassis), regulation-compliant PCB
Dimensions1 x 3 x .4.7" (24 x 77 x 120 mm)
Weight7.9 0z (224 g)
Encoder
Video Inputs1 x SD/HD-SDI (75 Ohms BNC)
1 x HDMI type A receptacle
Channel BondingTeraLink
Supported Resolutions1080p 23.98/24/25/29.97/30/50/59.94/60
1080i 50/59.94/60
1080psF 23/24/25/29/30
720p 50/59.94/60
576i
480i
480p (for HDMI input only)
576p (for HDMI input only)
Ingests 1080p 50/59/60
Video CompressionH.264, Baseline, Main, and High Profile
Supported Video Bit Rates250 kbps to 15 Mbps
15 Mbps (wired), 10 Mbps (Wi-Fi)
Test Pattern GeneratorSupports custom test pattern
Video FormatBuilt-in video scaler and deinterlacer
Color CorrectionCDL/1024 1D LUT (supports 10-bit color)
33 x 33 x 33 3D LUT (supports 10-bit color)
Network ProtocolsTCP/IP, UDP, HTTP, DHCP, NTP, SSL, IGMP
Video Transport SupportSupported Video Transport Protocols:
RTMP
RTP, RTSP, RTSP over HTTP
MPEG-TS (MPEG-TS is an optional paid license)
Remote ControlTeradek Core
Software IntegrationUstream, YouTube Live, Facebook, and new Livestream
Audio CompressionAAC-LC, MPEG Layer 2
Audio InputEmbedded audio input
Analog line or mic in, adjustable gain
Audio OutputHeadphone output
InterfacesHttp: WebUI for configuration and control
Configuration Interfaces:
OLED display with joystick navigation buttons
Feature-rich WebUI for configuration and control
SwitchesOn/Off and reset switch
Recording storageSD Card: Full-size
Mobile AppVuer, Live:Air
USB InterfacePowered USB 2.0 host port
Ethernet10/100/1000 BASE-T gigabit
Wi-Fi2.4/5 GHz 802.11 ac/a/b/g/n MiMo
Channel SelectionAuto with three Modes: 2.4 or 5 GHz, Auto 2.4 GHz only, Auto (5 GHz only)
Configurable to specific channels
Encryption802.1x, 802,11i, WPA2, WPA, and WEP 64/128 TKIP 128-bit AES
Power Input2-pin connector power input
Power ConsumptionNominal: 8 W, 7 W (no Wi-Fi)
Power InputAuxiliary: 6-28 VDC
MountCan be mounted horizontally or vertically with 1/4"-20 mounting holes
ConstructionMilled aluminum
Dimensions4.75 x 3 x 1.1" [120.7 x 76.2 x 27.9 mm]
Weight11.6 oz (328.9 g)
Packaging Info
Package Weight6.95 lb
Box Dimensions (LxWxH)13.1 x 11.2 x 5.3"

Teradek Node Cellular 3G/4G/LTE USB Modem (Japan) Specs

NetworkLTE: LTE FDD Cat 4, Bands 1, 3, 5, 8, 19
UMTS: HSDPA Cat 24, HSUPA Cat 6, Bands 850/900/2100
RF: 2 x 2 MIMO SMA
Band 17 (700 MHz), Band 13 (750 MHz), Band 5 (850 MHz), Band 4 (1700 MHz), and Band 2 (1900 MHz)
Power Class: Class 3, 23 dBm LTE Mode
Class 3, 24 dBm for UMTS/HSDPA/HSUPA Mode
Data Rate: LTE Cat 4: Up to 150 Mb/s DL, 50 Mb/s UL
HSDPA Cat 14, Up to 21 Mb/s DL
HSUPA Cat 6, Up to 5.6 Mb/s UL
SIM: Full Size
Power Input2-Pin Connector, 5 to 28 V
Power Consumption5 W Maximum
Interface4-Pin LEMO-Type
Status Display2 x LEDs
TemperatureOperating: 14 to 122°F / -10 to 50°C
Storage: -40 to 194°F / -40 to 90°C
HumidityOperating: 5 to 95% (Non-Condensing)
Storage: Maximum 90%
ConstructionMilled Aluminum (Chassis), Regulation-Compliant PCB
Mounting1/4"-20 Threaded Hole
2 x 4-40 Threaded Holes
Dimensions3.3 x 0.7 x 2.2" / 82.8 x 18.5 x 59.3 mm
Weight4 oz / 110 g

Teradek Bond 659 Reviews

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