OWC / Other World Computing Mercury On-The-Go Pro Bus-Powered Multi-Interface Enclosure Kit

OWC / Other World Computing Mercury On-The-Go Pro Bus-Powered Multi-Interface Enclosure Kit

OWC / Other World Computing Mercury On-The-Go Pro Bus-Powered Multi-Interface Enclosure Kit

B&H # OWMOTGEFW8US MFR # OWCMSTG800U3KS
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Product Highlights

  • Fanless Design
  • Built-In Aluminum Heat Sink
  • Accepts 2.5" SATA Hard Drive or SSD
  • Bus-Powered
  • Mac & PC Compatible
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  • 1Description

The Mercury On-The-Go Pro Bus-Powered Multi-Interface Enclosure Kit from OWC is a pocket size bus powered enclosure kit that maximizes your mobile data storage. It accepts a 2.5" (63.5mm) SATA hard drive or SSD. You can thus upgrade your Mac or PC notebook's internal drive and re-task the old drive for use as an external drive. The enclosure's fanless design offers silent operation and keeps the drive cool.

High Performance
High performance with an Oxford combination FireWire and USB chipset creating one integrated storage solution.
Fanless Design
Fanless design offers near silent operation, and still keeps the drive cool.
Built-In Aluminum Heat Sink
Built-in aluminum heat sink underneath the drive and pass through cooling vents on the top of the case, work in tandem to provide optimum results.
In the Box
OWC / Other World Computing Mercury On-The-Go Pro Bus-Powered Multi-Interface Enclosure Kit
  • 15" (38.1cm) High Quality Double Shielded FireWire 800 Connecting Cable (9 to 9-Pin Cable)
  • 18" (45.7cm) High Quality Double Shielded USB 3.0/2.0/1.1 (9-Pin Mini A - B) Certified Connecting Cable
  • Carrying Case
  • Backup & Utility Software CD Bundle
  • 1-Year Warranty
  • Table of Contents
    • 1Description
    Number of Bays 1 x 2.5"
    Connections Not Specified by Manufacturer
    Compatible Drive Interface SATA
    Form Factor Not Specified by Manufacturer
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    Power Source FireWire
    Security
    Encryption Not Specified by Manufacturer
    Security Features Not Specified by Manufacturer
    Physical
    Maximum Drive Height 12.5 mm
    Cooling Not Specified by Manufacturer
    Bridge Chipset Oxford 944
    ASMedia ASM1051E
    Status Monitoring Not Specified by Manufacturer
    Dimensions (W x H x D) 3.5 x 1.0 x 5.5" / 88.9 x 25.4 x 139.7 mm
    Weight 0.44 lb / 0.19 kg
    Packaging Info
    Package Weight 1.1 lb
    Box Dimensions (LxWxH) 7.4 x 6.3 x 2.7"
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