The C583.CH450TB3 Mid Tower Chassis with 450W Power Supply from In Win has three 5.25", five 3.5" and, a single 2.5" drive bays for expandability and future upgrades. It is made with SECC Japanese steel. The chassis has qualified for TAC 2.0**, a mass ventilation hole side panel design that optimizes thermal efficiency, and cools down the entire system. With a screw-less front and side panel, swiveled HDD drive cage, this chassis has four screw-less PCI/AGP expansion slots.
Note:
**http://cache-www.intel.com/cd/00/00/38/71/387155_387155.pdf
TAC 2.0 Thermal Solution
Qualified for TAC 2.0, a mass ventilation hole side panel design that optimizes efficiency and cools down the entire system.
Tool-Free Installation
It has a tool-free front panel, drive bays, and I/O slots. In addition, it has a screw-less front and side panel, swiveled HDD drive cage, four screw-less PCI/AGP expansion slots, and screw-less 5.25" and 3.5" drive bays.
Side Panel Clip
The chassis has a tool-free installation side panel clip.
Folded Edge
For safety installation it has no sharp edges.
Stamped Motherboard Support
It does not require motherboard standoffs to be installed as it has stamped motherboard support for faster motherboard installation.
Configured Nine Drive Bays
The chassis is equipped with a single 2.5", five 3.5", and three 5.25" drive bays for expandability of future upgrade.
Security
It has standard padlock loop for padlock and also supports the Kensington Security Slot.