Thermaltake TG-30 Thermal Compound

BH #THTG30TC • MFR #CL-O023-GROSGM-A
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Thermaltake TG-30 Thermal Compound
Key Features
  • 4g Syringe
  • 4.5 W/m-k Thermal Conductivity
  • Includes Application Kit
Efficiently transfer heat from your CPU and other components with the Thermaltake TG-30 Thermal Compound. This compound supports 4.5 W/m-k thermal conductivity and may be evenly applied onto your CPU using the syringe and included honeycomb stencil kit.
More Details
Special Order
Expected availability: 2-4 Weeks
No Store Display
Shipping Charges Apply
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800-606-6969

Thermaltake CL-O023-GROSGM-A Overview

Efficiently transfer heat from your CPU and other components with the Thermaltake TG-30 Thermal Compound. This compound supports 4.5 W/m-k thermal conductivity and may be evenly applied onto your CPU using the syringe and included honeycomb stencil kit.

UPC: 841163075845

Thermaltake CL-O023-GROSGM-A Specs

General
Performance
Thermal Conductivity: 4.5 W/m-k
Density: 2.55 g / cm3
Thermal Impedance: 32°F / 0.185°C per in2 / W
Viscosity: 76 Pa-s
Physical
Color
Gray
Weight
0.1 oz / 4 g
Packaging Info
Package Weight
0.03 lb
Box Dimensions (LxWxH)
7.25 x 3.3 x 0.55"

Thermaltake CL-O023-GROSGM-A Reviews

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